
Global Unichip Corporation provides advanced ASIC design, interface IP, and production services for custom AI, HPC, networking, and automotive chips.
guc-asic.comCrawled Oct 10, 2026
As a global leader in advanced ASIC solutions, GUC continues to redefine semiconductor innovation through system-level design excellence, with applications spanning artificial intelligence (AI), high-performance computing (HPC), network infrastructure, automotive electronics, consumer electronics, and industrial systems.
GUC provides an advanced 2.5D/3D multi-die packaging technology platform for ASIC customers in AI, HPC, and networking. Its comprehensive 2.5D/3D ASIC solutions include key IP (UCIe, GLink-2.5D/GLink-3D, and HBM), 2.5D/3D package design (CoWoS, InFO, SoIC, and wafer-level systems), SI/PI co-simulation, and 2.5D/3D manufacturing and production ramp-up support.
From Design to Production - Empowering the Future of Intelligent Systems.
At GUC, we regard our customers as our most valuable asset and are committed to building long-lasting, strong partnerships. With our industry-leading, full-service ASIC solutions, we help customers achieve their goals and tackle the most demanding IC design challenges.
Trusted ASIC Partner For Industry Leaders
As a global leader in advanced ASIC solutions, Global Unichip Corp. (GUC) continues to redefine semiconductor innovation through system-level design excellence, serving artificial intelligence (AI), high-performance computing (HPC), network infrastructure, automotive electronics, consumer electronics, and industrial systems.
GUC’s Sustainability Commitment and Policy
GUC empowers talent with comprehensive career development, enabling you to grow through challenges and make a lasting impact in IC design.
GUC is committed to comprehensive career development, helping talent grow through challenges and make a lasting impact in IC design.
We are looking for passionate and skilled talents to join our world-class IC design services team, create technological value and industry impact with Creative.
We warmly invite passionate and skilled people to join our world-class IC design services team and create value and industry impact with Creative.
GUC's seasoned leadership team drives innovation and growth, leading the company to expand and excel in global markets.
Driving Innovation, Connecting the Future
GUC combines advanced packaging technology (APT), outstanding design solutions, and trusted services to deliver unparalleled performance and reliability, helping customers stand out in competitive markets.
GUC combines advanced packaging technology (APT), outstanding design solutions, and trusted services to deliver unparalleled performance and reliability, helping customers stand out in competitive markets.
GUC combines advanced packaging technology (APT), outstanding design solutions, and reliable services to deliver unparalleled performance and stability, helping customers stand out in highly competitive markets.
GUC Showcases VSORA Jotunn8 AI Inference Processor at TSMC Europe Technology Symposium
Engineering Excellence. Global Trust. Forward Together.
GUC Showcases VSORA's Jotunn8 AI Inference Processor at the TSMC Europe Technology Symposium
GUC Showcases VSORA Jotunn8 AI Inference Processor at TSMC Europe Technology Symposium
Global Unichip Corp. (GUC) announces 2nm 16 Gbps HBM4E IP. The announcement is dated September 22, 2026, in Hsinchu, Taiwan.
Sep 2026 · gucNews article
GUC and Wiwynn announce a strategic technical collaboration combining GUC’s SoC design and 2.5D/3D advanced packaging with Wiwynn’s rack-scale system integration, liquid cooling, and optical interconnect expertise. The companies say the integration is intended to help hyperscale customers advance silicon-to-system infrastructure more efficiently.
May 2026 · gucNews article
Global Unichip Corp. (GUC) announces the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC’s 3nm process technology. Demonstrated at the TSMC 2026 North America Technology Symposium, the platform combines GUC’s in-house full-functional HBM4 Controller and PHY IP with a partner’s HBM4 memory and TSMC CoWoS advanced packaging technology.
Apr 2026 · gucNews article
Lightmatter and GUC partner to produce co-packaged optics (CPO) solutions for AI hyperscalers. Their collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform, with the stated aim of redefining scalability for AI infrastructure.
Jan 2026 · gucNews article