Onto Innovation

Overlay, CD and height metrology for 300mm wafers in the advanced packaging, compound semiconductor, power devices, RF, MEMS and LED markets.

All-surface defect and contamination inspection for unpatterned glass panel substrates with imaging capability for panels up to 600x600mm in size.

All-surface defect and contamination inspection for unpatterned wafer and blanket films, with imaging capability for opaque, transparent and semi-transparent wafers, reticles and piece parts.

Onto Innovation's PrecisionWorx VX4 System enhances testing of the latest probe card technologies with tighter pitches, smaller pads, and higher pin counts.

The page describes how advanced packaging priorities have shifted from miniaturization toward larger packages with more functionality and sophisticated thermal management for AI-driven applications.

The page reflects on 2021 as a year of unprecedented surprises and growth in the semiconductor industry.

The article says artificial intelligence, high-performance computing and smartphones drive the semiconductor industry; 3nm nodes are in production and 2nm nodes are on the horizon, increasing the importance of film measurement.

Onto Innovation resulted from the 2019 merger of equals between two process control solutions providers seeking to serve the semiconductor manufacturing supply chain end to end.

The company says continued success requires maintaining a team across all functions.

Onto Innovation's history in semiconductor manufacturing technology dates back to the 1940s.

Onto Innovation is a leader in semiconductor manufacturing software & solutions that solve the most difficult yield, device performance, quality, & reliability issues.

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