Process Window Analyzer examines every SEM image from focus-exposure modulations for die-to-database defects and measures every feature of interest to produce pattern uniformity statistics. Unlike conventional methods that look only for hard defects, PWA captures subtle pattern fidelity variations that increasingly drive parametric yield loss.

The system tracks uniformity of like patterns across each modulation to generate Bossung curves automatically for large sets of patterns, providing faster and wider coverage than traditional CD-SEM analysis. The resulting insight is fed back to OPC and lithography teams to establish tighter, more robust process windows.