Avicena Tech

Avicena builds microLED optical interconnects for AI chip-to-chip and memory links.

Founded

2019

Product Overview

LightBundle couples arrays of GaN microLED emitters to matching photodetectors through multi-core fiber. Each evaluation kit includes a transceiver ASIC with 256-element emitter and detector arrays plus tools for bit-error-ratio and receiver-eye measurements.

The company ships terabit-class LightBundle evaluation kits so hyperscalers and semiconductor teams can characterize the optical links in their own laboratories.

Market Outlook

AI training and inference clusters are hitting copper reach and power limits as GPU counts grow across racks. Operators need scale-up interconnects that keep energy per bit low while raising shoreline density.

Avicena positions LightBundle for die-to-die, processor-to-memory, and processor-to-switch links inside those AI scale-up fabrics.

Competitive Advantages

Unlike laser or silicon-photonics interconnects, Avicena microLED links are designed to sit directly on CMOS ICs and to reach up to about 10 meters. The architecture uses hundreds of parallel optical lanes rather than a few high-power lasers.

The approach is intended to extend GPU clusters across racks at sub-picojoule-per-bit energy while remaining compatible with parallel chiplet interfaces such as UCIe.