Besi makes semiconductor assembly equipment for multinational chip manufacturers and assembly subcontractors, a single-line industrial rather than consumer business.
Besi's breadth across several back-end assembly steps distinguishes its semiconductor assembly equipment for advanced packaging from a single tool family, spanning separate die attach (single and multi chip, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid bonding, die sorting), packaging (molding, trim and form, singulation systems), and plating (tin, copper, precious metal and solar plating systems and process chemicals) families, plus tooling, conversion kits, spare parts and services for installed equipment.
Besi sells to multinational chip manufacturers and assembly subcontractors. These customers either run the equipment in their own fabs or assemble packages for third parties on contract.
