China Wafer Level CSP

China Wafer Level CSP Co., Ltd. reports **CNY 1.06 billion in sales** for the first nine months of 2026, a slight decline from CNY 1.07 billion in the same period last year. The company’s net income drops to **CNY 203.5 million**, down from CNY 273.8 million year-over-year. The earnings reflect a contraction in profitability despite relatively stable revenue.

Oct 2026MarketScreenerNews article

China Wafer Level CSP plans to award **747,700 restricted shares** to seven employees as part of an incentive program. The proposal follows a filing with the Shanghai Stock Exchange. The move aligns with equity-based compensation strategies to retain key talent in the semiconductor packaging sector.

Sep 2026MarketScreenerNews article

China Wafer Level CSP Co Ltd is preparing to spin off a subsidiary for an initial public offering on the Euronext Amsterdam exchange. The move aims to expand the company’s international presence in semiconductor packaging solutions. The listing will allow the unit to access European capital markets and broaden investor access.

May 2026ReutersNews article

China Wafer Level CSP Co., Ltd. acquires a 73% stake in Anteryon International B.V. for €32.3 million. The deal was finalized on January 2, 2019, marking the company’s expansion into European semiconductor packaging solutions. Legal and financial advisors, including DLA Piper and Ernst & Young, supported the transaction.

Jan 2019MarketScreenerNews article