deepx.aiCrawled Oct 31, 2026
The DX-H1 Quattro delivers a powerful 100 TOPS (INT8) of performance while maintaining a remarkably low Thermal Design Power (TDP) of just 20W. This makes it
DX-H1 V-NPU is DEEPX's 40W edge AI chip delivering 50 TOPS NPU performance with built-in video codecs, cutting VMS hardware costs up to 82% vs GPUs.
DX-M1 brings computer vision, language generation, and visual understanding to edge devices. Delivering 25 TOPS of INT8 AI compute, it combines a compact
Avnet Silica and DEEPX introduce AI inference acceleration technology available in EMEA.
The DX-M1 chip combines vision and processing capabilities for edge AI applications.
Ultralytics and DEEPX demonstrate fast, efficient YOLO inference on NPU-powered edge AI hardware.
Join Avnet Edge & Beyond Tech Days 2026 — a regional technology conference and exhibition designed for engineers, product leaders, and decision‑makers navigating the next phase of AI, edge computing, and intelligent systems.
DEEPX partners with Koshida to expand Physical AI in Japan's market during the 2026 Physical AI Expo in Tokyo.
DEEPX and AAEON collaborate to integrate NPU in industrial computers, enhancing edge gateways over a three-year partnership.
The DX-M1 chip enables fully on-device SLMs for ultra-low power and high-performance edge AI solutions.
DEEPX offers job openings and encourages applications for its growing AI-focused team.
DEEPX seeks collaborations and strategic alliances to expand its reach.
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