Echint

Chengdu Yicheng Technology secures Series C funding led by Chengdu Hi-Tech Investment Group. The company specializes in panel-level advanced packaging, enabling integration of multiple chips onto a single large glass substrate. This technology supports high-performance semiconductor applications.

Nov 2026dealroom.coNews article

Chinese firms BOE and ECHINT are accelerating development of **TGV (Through Glass Via) glass substrate technology** for advanced chip packaging. The technology gains industry focus as demand for high-performance packaging solutions grows. Industry sources highlight China’s push to strengthen its position in semiconductor manufacturing infrastructure.

Oct 2025TrendForceNews article

Matrix Partners China co-leads a **$139 million Series B** funding round for **Echint**, a Chinese start-up specializing in **semiconductor chip packaging and testing**. The company was incubated by **Eswin**, a VC-backed semiconductor firm. Echint secures the investment to advance its technology in high-demand semiconductor assembly solutions.

Aug 2023https://www.avcj.comNews article

Chengdu Echint Technology secures over one billion CNY in Series B funding to advance its technology solutions. The funding round highlights growing investor confidence in the company’s growth trajectory. Echint specializes in industrial automation and smart manufacturing technologies.

Aug 2023EqualOceanNews article