EnaChip

Why Manufacturing, Not Design, Has Been the Real Barrier

A paper exploring laminated core structures and lithography-defined approaches to compact magnetic integration.

Join EnaChip to build foundational power delivery technology at the intersection of materials, semiconductors, and systems.

Built at the intersection of materials, semiconductors, and systems to remove power delivery as a constraint on compute progress.

EnaChip is developing integrated magnetics for next-generation power delivery—moving from discrete board-level components to package and chip-level integration with greater efficiency, density, and scale.

EnaChip secures funding from investors including Stata Capital, Osage University Partners, and Boston Seed Capital to develop wafer-level magnetic technology for semiconductor power delivery. The round also involves Anzu Partners and Longview Innovation. The company focuses on improving power efficiency in semiconductor applications.

Jan 2026enachip.comNews article

EnaChip develops magnetic components for microdevices by electroplating custom magnetic alloys onto semiconductor substrates. The approach delivers high-performance solutions while maintaining cost efficiency. These innovations target advanced applications in electronics and miniaturized systems.

Jun 2024Penn Center for InnovationNews article

EnaChip develops wafer-level magnetic technology by coating specialized magnetic alloys directly onto semiconductor substrates. The company aims to commercialize this platform to enable new classes of high-performance electronic products. Trifon Liakopoulos, co-founder and CTO, leads the effort to disrupt power electronics systems design.

May 2024Magnetics MagazineNews article

Thirty-seven startups secure $1.7 billion in funding in September 2021, with data center chip companies and advanced driver-assistance systems (ADAS) firms in China leading investment activity. The funding highlights strong sectoral interest in semiconductor innovation and automotive technology. Specific companies or deal sizes are not detailed in the report.

Oct 2021Semiconductor EngineeringNews article