GUC

GUC provides a 2.5D/3D multi-die packaging platform for ASIC customers in AI, HPC, and networking. Solutions include UCIe, GLink-2.5D/GLink-3D and HBM IP, package design, SI/PI co-simulation, and manufacturing support.

From Design to Production - Empowering the Future of Intelligent Systems.

GUC says it values its customers and aims to build long-term partnerships. It provides full-service ASIC solutions for IC design challenges.

GUC says it considers customers valuable and aims to build long-term partnerships. It provides full-service ASIC solutions for IC design projects.

Trusted ASIC Partner For Industry Leaders

Global Unichip Corp. (GUC) provides advanced ASIC solutions based on system-level design for AI, high-performance computing (HPC), network infrastructure, automotive and consumer electronics, and industrial systems.

GUC’s Sustainability Commitment and Policy

GUC offers career development, with opportunities to grow through challenges and make an impact in IC design.

Creative seeks skilled candidates to join its IC design services team.

Creative Electronics seeks skilled candidates to join its IC design services team.

GUC seeks skilled colleagues to join its IC design services team.

GUC's seasoned leadership team drives innovation and growth, leading the company to expand and excel in global markets.

Driving Innovation, Connecting the Future

The company focuses on environmental, social responsibility, and corporate governance in connection with sustainable business practices.

GUC Showcases VSORA Jotunn8 AI Inference Processor at TSMC Europe Technology Symposium

Engineering Excellence. Global Trust. Forward Together.

GUC Showcases VSORA's Jotunn8 AI Inference Processor at the TSMC Europe Technology Symposium

Global Unichip Corp. (GUC) announces 2nm 16 Gbps HBM4E IP. The announcement is dated September 22, 2026, in Hsinchu, Taiwan.

Sep 2026 · gucNews article

GUC and Wiwynn announce a strategic technical collaboration combining GUC’s SoC design and 2.5D/3D advanced packaging with Wiwynn’s rack-scale system integration, liquid cooling, and optical interconnect expertise. The companies say the integration is intended to help hyperscale customers advance silicon-to-system infrastructure more efficiently.

May 2026 · gucNews article

Global Unichip Corp. (GUC) announces the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC’s 3nm process technology. Demonstrated at the TSMC 2026 North America Technology Symposium, the platform combines GUC’s in-house full-functional HBM4 Controller and PHY IP with a partner’s HBM4 memory and TSMC CoWoS advanced packaging technology.

Apr 2026 · gucNews article

Lightmatter and GUC partner to produce co-packaged optics (CPO) solutions for AI hyperscalers. Their collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform, with the stated aim of redefining scalability for AI infrastructure.

Jan 2026 · gucNews article