Huatian Technology
Huatian Technology offers semiconductor assembly and test spanning package design, leadframe, substrate, wafer-level packaging, wafer and functional test, and logistics.
- Public company
- Tianshui, Gansu, CNChina
Huatian Technology offers semiconductor assembly and test spanning package design, leadframe, substrate, wafer-level packaging, wafer and functional test, and logistics.
Tianshui Huatian Technology reports a **9.2% year-over-year decline in Q3 net profit attributable to shareholders**, reaching **287.1 million yuan**. Earnings per share (EPS) also fell by **14%**, while revenue increased during the same period. The company’s financial filing highlights a contraction in profitability despite growth in overall revenue.
Nov 2026MarketScreenerNews article
Tianshui Huatian Technology Co., Ltd. acquires Huayi Microelectronics Co., Ltd. from a group of shareholders. The transaction finalizes the transfer of ownership, expanding Tianshui Huatian’s microelectronics capabilities. The deal marks a strategic consolidation in the semiconductor sector.
Oct 2026MarketScreenerNews article
Huatian receives approval from China’s securities regulator to acquire Huayi, a chipmaker. The registration clearance removes a major obstacle for the deal’s completion. The transaction follows regulatory scrutiny under China’s securities laws.
Sep 2026DealroomNews article
Tianshui Huatian Technology Co., Ltd. reports **CNY 10.25 billion in sales** for the first half of 2026, up from **CNY 7.59 billion** in the same period last year. The company’s revenue growth reflects a significant year-over-year increase in its financial performance. No additional operational or segment-specific details are provided in the earnings update.
Aug 2026MarketScreenerNews article