
Ibiden makes IC package substrates, SiC-DPF, substrate holding mats, graphite products, high temperature insulation wool, and EV battery safety materials.
ibiden.comCrawled Nov 14, 2026
Ibiden develops high-density printed circuit boards for information terminals, IC package substrates, and DPF as its core products, aiming to provide top-tier technology.
Ibiden specializes in plastic packaging, printed circuit boards, and related electronics products, as well as DPF and special carbon products in ceramics. The company drives technological innovation and collaborates with global leaders in each field.
IBIDEN Co., Ltd. is included in MSCI’s Japan ESG Select Leaders Index and MSCI Nihonkabu ESG Select Leaders Index. The company has been part of the Japan-focused index since its 2017 launch, marking ten consecutive years of selection. IBIDEN also joins MSCI’s broader MSCI Selection Indexes.
Jul 2026ibiden.comNews article
IBIDEN Co., Ltd. secures inclusion in the FTSE4Good Index Series for the 11th straight year, alongside the FTSE JPX Blossom Japan Index (10th year) and FTSE JPX Blossom Japan Sector Relative Index (5th year). The company, led by President Koji Kawashima, maintains its standing in these ESG-focused investment benchmarks, reflecting sustained recognition of its environmental, social, and governance practices.
Jul 2026ibiden.comNews article
IBIDEN CO., LTD. submits its Corporate Governance Report to the Tokyo Stock Exchange and publishes it on its official website. The company, headquartered in Ogaki City, Gifu Prefecture, is led by Representative Director and President Koji Kawashima. This report fulfills regulatory disclosure requirements for listed firms.
Jun 2026ibiden.comNews article
IBIDEN CO., LTD. approves a **500 billion yen capital investment plan** for its electronics business, covering fiscal years 2026–2028. The initiative targets **high-performance IC package substrates**, aligning with previously disclosed **2030 fiscal targets**. The Board of Directors, led by President Koji Kawashima, finalizes the plan to expand production capacity and advance semiconductor packaging technology.
Feb 2026ibiden.comNews article