iSABers

The company designs and manufactures advanced bonding equipment.

The company delivers end-to-end solutions for semiconductor manufacturing lines.

The group provides updates on company news and developments.

The page offers inquiries about the company’s products.

The company develops high-end bonding equipment and provides precision bonding process services for advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors. Its solutions combine equipment manufacturing with process services, featuring four proprietary product lines: ultra-high-vacuum room-temperature bonding systems, hybrid bonding tools, thermal compression bonding equipment, and supporting process services.

Chinese manufacturers of semiconductor equipment attract new investment amid rising demand for AI and high-performance computing. The sector sees accelerated localization in high-end bonding tools, automated test equipment (ATE), and wide bandgap semiconductor material equipment. Global financing for semiconductor equipment remains active, with overseas firms advancing disruptive lithography technologies.

Mar 2026TrendForceNews article

iSABers Materials secures **RMB 220 million** in a Series A++ funding round to advance its semiconductor materials bonding and integration technologies. The company specializes in solutions for semiconductor manufacturing, targeting improved chip performance and efficiency. This financing round highlights growing investor confidence in its proprietary bonding techniques for next-generation semiconductor devices.

May 2023EqualOceanNews article

Isabers secures CNY 200 million (USD 28.74 million) in a Series A++ funding round from multiple investors. The company specializes in semiconductor heterogeneous integration technology, focusing on advanced chip design solutions. This funding supports further development of its core technologies in the semiconductor sector.

Sep 2022EqualOceanNews article