Ixana

Explore Wi-R silicon: YR23 and YR31 for wearable area networks, XA-NFE2001 and XA-NFE3001 for near field links. Under 1 ms latency at low power.

Wi-R YR23 and XA-NFE2001 development kits include paired boards, an SDK, documentation, and test tools for wearables and near-field devices.

Ixana’s Wi-R product portfolio includes Wi-R Link and Wi-R NFE chips, modules, reference designs, and development kits for low-power E-field wireless in wearables, AR/VR, robotics, and industrial systems.

Production ready Wi-R reference designs, from all day video streaming smart glasses to tactical headset to radio links. Request a demo kit to evaluate.

Deep dive technical articles, engineering updates, and industry insights on E-field communication and Wi-R solutions from the Ixana team.

Why cloud AI has rack-scale fabrics while Physical AI needs a local interconnect to move data efficiently across bodies, wearables, and nearby compute.

How Wi-R NFE enables portless service for sealed automotive ECUs and ADAS modules: provisioning, diagnostics, and calibration without opening the case.

What the Samsung Galaxy Ring reveals about wireless power budgets, and how Wi-R cuts radio current 15x compared to Bluetooth in smart rings.

Ixana lists open positions in engineering, research, and other areas.

Ixana develops Wi-R chips: low power, low latency wireless connectivity for wearables, earbuds, smart glasses, and near field data transfer.

Ixana offers sales, support, and development kits for its Wi-R chips: YR23 and YR31 for wearable networks, and XA-NFE2001 and XA-NFE3001 for near field.

Ixana builds E-field communication silicon for distributed sensors, compute, and actuators across worn devices, robots, and machines.