kandou.aiCrawled Nov 11, 2026
Breakthrough AI infrastructure with Copper MIMO technology. Higher bandwidth, longer reach, lower power for GPU, memory, network, and rack connectivity.
Ultra-short reach SerDes IP delivering 500 Gbit/s throughput for chiplets and MCMs. 1 Tbit/s per Watt, no interposer required. Power AI infrastructure.
Ultra-low latency PCIe 5.0 retimer with sub-13ns performance. Supports CXL 2.0, up to 32 GT/s, x16 lanes. Exceptional signal integrity for AI & data centers.
As USB has evolved with higher rates and more complex protocols, designers turned to analog redrivers to handle some of those issues.
Kandou Bus transmits data between wired chips using spatial coding to create signal correlations.
The 50th episode of the podcast features Dr. Darbari and Dr. Amin Shokrollahi discussing Shokrollahi’s early life.
Kandou was named to the Tech Tour Growth50 List as a potential future European unicorn.
Regli is a multiprotocol retimer for PCIe 5.0 and CXL 2.0, designed for data centers and hyperscalers.
Semiconductor Engineering published a white paper on Kandou’s Glasswing IP.
The AI House connects industry leaders, tech founders, research, companies, investors and policy makers to discuss the impact of AI on the world.
Kandou develops high-speed connectivity solutions for AI infrastructure.
Kandou Bus handles sales and media inquiries about its technology and products.
Revolutionary Copper MIMO technology eliminates costly HBM chips. 10X lower cost, 3X lower power, 8X more scale for next-gen AI systems and connectivity.
Kandou.ai outlines how it collects, uses, shares, and protects personal data in its privacy practices.
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