
Builds laser-induced forward transfer systems for digital solder paste printing.
keirontechnologies.comCrawled Oct 16, 2026
The HF2 LiFT Printer replaces stencil printer, jet printer and SPI in one digital system. 1nL precision. Integrated SPVM. First-pass yield >95%.
Stop chasing SPI results and fix paste variation at the source. How closed-loop control with integrated 3D metrology eliminates drift-driven SMT defects.
Keiron's HF2 LiFT Printer wins the 2026 NPI Award, recognised for transforming solder paste printing with nanolitre precision and stencil-free deposition.
Latest Keiron news, press releases and events. Follow webinars, tradeshows and SMT insights on LiFT precision SPP technology, yield and process control.
Overcome electronics manufacturing obstacles with NPI acceleration. Keiron Technologies explains stencil-free deposition to cut changeovers to minutes.
Open roles at Keiron: mechatronics and optics engineers, VP Sales, service engineers and software developers. Positions at HTC Eindhoven, Boston and APAC.
Install, validate and support Keiron's LiFT solder paste printing systems across Europe. Based in Eindhoven; 4+ years high-tech support required.
The role involves building machine control software in C# for Keiron's LiFT precision solder paste printer and requires five years of experience and strong C# skills. It is based at HTC Eindhoven.
The page describes Keiron's LiFT precision solder paste printing technology.
Contact Keiron to discuss demonstrations, partnerships, technical questions or opportunities in SMT manufacturing.
Keiron LiFT replaces stencil, jet printing and SPI in one digital system. It is described as boosting first-pass yield from 60% to over 95%, without stencils or consumables.
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Keiron Printing Technologies raises EUR 20.7 million in Series A financing to scale its laser-induced forward transfer (LiFT) solder paste printing technology. The technology is intended for high-reliability electronics.
Jul 2026EMSNowNews article
Keiron raises EUR 20.7 million in a Series A round to industrialize laser-based solder paste printing for electronics assembly.
Jul 2026IO+News article
Keiron Printing Technologies announces a Series A funding round of EUR 20.7 million. The company plans to expand production and commercial operations for its laser-based solder paste printing platform, the HF2 LiFT printer.
Jul 2026SMT TodayNews article
Keiron appoints PIT Equipment Services as a sales and technical support representative for customers adopting LiFT printers. The announcement identifies PIT’s role in supporting adoption of Keiron’s LiFT technology.
Jan 2026SMT TodayNews article