Kinsus

CSP technology meets demands for thinner, lighter IC packages in handheld devices.

Renewable Energy an d Resource Conservation/ Efficiency

FCCSP packaging gains cost advantages as smartphone processor pin counts rise and on-chip bump manufacturing declines.

PBGA substrates use copper-clad laminate for high-pin-count chip packaging, replacing inadequate lead-frame structures.

The Kinsus Resource Center provides annual Sustainability Reports covering Environmental, Social, and Governance (ESG) initiatives.

Kinsus Achieves Strong Results at the TPCA Health Cup Badminton Tournament, Strengthening Team Cohesion

Kinsus Advances ESG Social Inclusion by Supporting the Gaoqing Road Improvement Project in Partnership with Taoyuan City Government

Kinsus Joins Autumn Coastal Cleanup, Employees Take Action to Protect the Marine Environment

Kinsus Releases 2025 Sustainability Report, Advancing Steadily Toward a Net-Zero Future

Kinsus offers competitive compensation and benefits to retain talent for sustainable growth.

Kinsus provides full-process substrate manufacturing, from circuit design to automated testing, for global customers.

Kinsus enhances employee skills via training programs and an e-learning platform for continuous professional growth.

Goals and Objectives: Promote harmonious labor-management relations, attract and retain outstanding talent, and provide competitive compensation and benefits, training and development, and fair promotion opportunities, enabling employees to become partners in the Company’s sustainable development.

Doctor of Electrical Engineering & Computer Science/NCKU

Electrical Engineering, National Taipei University of Technology

• Bachelor degree in Industrial and Business Management,Tatung Institute of Technology • Honorary Doctor of Business,Tatung University • Chief Operating Officer of Pegatron Corporation • Senior Vice President of Unihan Corporation

Kinsus supports local communities through care programs, charity initiatives, and academic collaborations.

Kinsus promotes green manufacturing, renewable energy procurement, water recycling, and circular economy practices.

Kinsus enforces risk management, information security, and business integrity to ensure sustainable operations.

The page outlines Kinsus Interconnect Technology’s ESG governance, green manufacturing, carbon reduction, and social responsibility efforts.

Communication channels for key stakeholders

No.1245, Zhonghua Rd., Xinwu Dist., Taoyuan City 327, Taiwan, R.O.C.

Kinsus Interconnect Technology supplies IC substrates and advanced packaging while promoting ESG sustainability.

Kinsus protects personal information and complies with data privacy laws and regulations.

Kinsus Interconnect Technology Corp. enforces a Supplier Code of Conduct based on Responsible Business Alliance (RBA) standards.

Kinsus Interconnect Technology Corp. is investing NT$23.5 billion over three years to expand AI chip substrate production. The company, specializing in ABF and BT substrates, allocates NT$7–8 billion for 2026 to meet rising demand driven by AI chip manufacturing. The funding prioritizes scaling substrate capacity to support semiconductor industry growth.

Oct 2026Tech InsiderNews article

Kinsus Technology is advancing AI chip substrates beyond passive carriers to enhance system performance through innovations in advanced packaging scaling and ABF (Anisotropic Conductive Film) materials. The company also addresses challenges in next-generation glass core manufacturing, positioning substrates as pivotal enablers for AI hardware efficiency. Developments focus on improving thermal management, signal integrity, and miniaturization for high-performance computing applications.

Oct 2026tspasemiconductor.substack.comNews article

Kinsus, Taiwan’s leading chip substrate supplier, invests billions to expand production capacity and upgrade technology. The move aims to compete with Nvidia and TSMC in meeting growing AI infrastructure demands. The company targets advancements in substrate manufacturing to support next-generation semiconductor needs.

Mar 2026Nikkei AsiaNews article

Kinsus Interconnect Technology reports a **31-fold increase in 2025 profits**, driven by rising substrate prices and demand for high-end products. The company plans to invest **NT$23.5 billion** in expanding its **ABF substrate production capacity** over the next three years to meet growing market needs. The financial report highlights strong performance in the semiconductor substrate sector.

Feb 2026BigGo FinanceNews article