Ligent Technologies

400G and 800G ZR and ZR+ pluggable transceivers enable high-speed, low-power data center interconnects with extended reach and vendor interoperability.

Successfully developed and mass-produced DFB laser chips, including 75 mW high-power continuous-wave DFB (CW-DFB) lasers. Currently developing 100 G/200 G EML laser chips, 100 mW and higher-power CW-DFB lasers, and 50 G EML laser chips.

Ligent showcased next-generation optical AI technologies, including 800G gearbox, NPO, 1.6T LPO, and 400G/L demos, at OFC 2026.

Ligent Technologies, Inc. provides optical communication and interconnection solutions, including AI-interconnect optical chips and high-speed optical modules, with in-house R&D and mass production.

The company embeds Environmental, Social, and Governance (ESG) concepts into governance and operations, focusing on compliance, risk control, and transparent disclosure.

The company promotes sustainable development by balancing environmental, social, and economic benefits across its operations.

Ligent prioritizes quality and innovation to deliver reliable products and services, fostering a trusted brand through employee engagement and continuous improvement.

2580 N.FirstSt,Sulte #400, San Jose, CA 95131, U.S.A.

Ligent Technologies, Inc. offers optical communication and interconnection solutions, including AI-interconnect optical chips and high-speed optical modules, with in-house R&D and mass production.

This policy outlines Ligent Inc.’s data practices for its business-to-business services in the United States, including personal information transfers.

Ligent emphasizes compliance as a foundation for sustainability, adhering to laws, regulations, and ethical standards to maintain its reputation.