Lux Semiconductors Company Profile - aVenture Research
Lux Semiconductors
Metal substrates and interposers for system-in-package designs, with higher thermal conductivity than glass and better warpage resistance than organics.
Lux Semiconductors makes metal substrates and interposers for advanced packaging, a metal core that replaces the glass and organic layers beneath a system-in-package. The company publishes design rules for transferring an existing organic substrate to metal with the build-up layers unchanged, and it manufactures in the United States.
The metal core competes with glass and organic substrates on thermal and mechanical performance: higher thermal conductivity than glass, greater stiffness against warpage than organics, and patented coaxial through-metal vias that shield signal lines inside the package. Lux says the technology was developed for defense electronics and that it now targets commercial manufacturers building system-in-package designs for artificial intelligence, autonomous vehicles, and advanced healthcare.