The innovation of NBE’s nanoTach technology comes from proprietary formulation and procedures for making uniform pastes and films of silver powders. In recent years, die-attach based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing.
For sales support: sales@nbetech.com; (540) 392-9820 For technical support: technical@nbetech.com Mailing address: P.O. Box 10935, Blacksburg, VA 24062, USA
Products Pastes of silver powder in organic solvent/binder for bonding chips without pressure and at temperature less than 250oC. Dry films of silver powder for bonding chips under < 10 MPa pressure and at < 260oC.
Products Pastes of silver powder in organic solvent/binder for bonding chips without pressure and at temperature less than 250oC. Dry films of silver powder for bonding chips under < 10 MPa pressure and at < 260oC.