Rapidus

Rapidus describes its RUMS (Rapid and Unified Manufacturing Service) business model and four core technologies: Raads, DMCO, GAA transistors, and chiplet packaging. It works with customers to shorten cycle times across design, wafer processing, and 3D packaging.

The page outlines semiconductor packaging processes, including bump formation, dicing, flip-chip assembly, encapsulation, and testing, and introduces Rapidus Chiplet Solutions (RCS) in the context of chiplets and 3D stacking.

An outlook on how semiconductors will drive innovation in fields such as AI, autonomous driving, healthcare, and EVs. A detailed look at energy-efficient edge AI semiconductors, power semiconductors’ contribution to EV adoption, and the future enabled by Rapidus’s 2nm strategy.

Rapidus Chairman Tetsuro Higashi discusses the company’s technology beyond 2nm, its transfer from IBM, the speed of EUV implementation and operation confirmation, and advanced semiconductors developed in Japan.

Henri Richard, President of Rapidus Design Solutions, discusses Rapidus’s strategy for supporting customers in the United States and around the world. He offers a candid look at expectations for a Japan-born foundry from Silicon Valley and why Rapidus will succeed.

Story content that weaves together Rapidus’s aspirations. Features technology articles explaining semiconductor technology and interviews introducing the people who work at Rapidus.

[Tokyo, December 13, 2022] IBM (NYSE: IBM) and Rapidus Corporation today announced a joint development partnership to advance logic scaling technology, as part of Japan’s efforts to become a global leader in semiconductor research, development, and manufacturing.

Rapidus Corporation entered an agreement with imec, a research institute in nanotechnology and digital technology, to participate in advanced semiconductor research.

Rapidus Corporation states that it respects applicants’ individuality and dignity in recruitment and prohibits harassment and discrimination based on personal characteristics.

Rapidus Corporation aims to develop and manufacture logic semiconductors using the world’s most advanced 2nm GAA process.

Company profile for Rapidus Corporation, including its date of establishment, capital, list of officers, offices, and history. Established in August 2022, with mass production scheduled to begin in 2027.

Junji Koike, Representative Director, President and CEO of Rapidus Corporation, discusses its mission to develop and manufacture logic semiconductors using a 2nm GAA process and improve people’s happiness, prosperity, and fulfillment through semiconductors.

Rapidus Corporation aims to develop and manufacture logic semiconductors using the world’s most advanced 2nm GAA process. Mass production is scheduled to begin in 2027.