Syenta

Syenta raises Series A from Playground Global and Australia’s National Reconstruction Fund to scale semiconductor innovation; Pat Gelsinger (Ex-CEO of Intel) joins the board.

Syenta has secured $4.8M AUD in Industry Growth Program funding to commercialise its LEM semiconductor packaging technology, accelerating the move from development to production and supporting global scale.

Syenta showcased Localised Electrochemical Manufacturing (LEM) technology at SPIE and IMAPS DPC 2025. CTO Ben Wilkinson and Head of Sales Sebastiaan Muller presented; LEM enables precise, scalable metal deposition across advanced applications.

Syenta is building next-generation semiconductor technology for AI computing alongside a team of engineers.

Syenta's Localized Electrochemical Manufacturing (LEM) technology enables high-resolution interconnects, a class of chip-to-chip connections that supports wafer-level system integration.

Syenta secures $26 million in funding to accelerate the production of chip interconnects, critical components for semiconductor performance. The investment supports advancements in high-speed data transfer technologies for next-generation computing systems. The company focuses on improving efficiency in semiconductor manufacturing processes.

Apr 2026SiliconANGLENews article

Australia's Syenta raises $26 million in a Series A to scale its semiconductor packaging technology and address AI memory bottlenecks. Playground Global leads the round, with Australia's National Reconstruction Fund participating, and the company plans to begin high-volume production in 2028. A former Intel CEO also joins Syenta.

Apr 2026ReutersNews article

Syenta announces its first U.S. facility at ASU Research Park in Tempe. The facility will support demonstration and development of the company’s advanced semiconductor packaging technology.

Apr 2026Arizona Commerce AuthorityNews article

Australian semiconductor technology company Syenta raises A$8.8 million in Pre-Series A funding to commercialize its chip-packaging technology. Investible led the round, which also included Blackbird Ventures, In-Q-Tel, SGInnovate, OIF Ventures, Salus Ventures, Jelix Ventures, Wollemi Capital Group, and Brindabella Capital.

Aug 20253D InCitesNews article