unisemgroup.comCrawled Nov 10, 2026
Unisem takes pride in its efficiency and innovation, both of which contribute to a dramatic
Unisem specializes in laminate package assembly and manufacturing, having developed several solutions.
Unisem’s leadframe package assembly and manufacturing systems provide for lower costs and higher yields of
The company offers turnkey services including package development, wafer probing, wafer bumping/WLCSP, assembly packaging, and final electrical testing.
Changes in Director’s Interest (Section 219 of CA 2016) – MR FRANCIS CHIA MONG TET
Changes in Sub. S-hldr’s Int (Section 138 of CA 2016) – MR JOHN CHIA SIN TET
Various investor announcements from Bursa (obsolete)
Quarterly report on consolidated results for the third financial quarter ended 30/09/2026
With a string of successes in the semiconductor industry, currently UNISEM has close to 7,000
Unisem has achieved multiple successes in the semiconductor industry.
John Chia Sin Tet became Chairman of the Company in 1991, Managing Director in 1998, and Group Managing Director in 2007. He is a Barrister at Law and a Member of Lincoln’s Inn, United Kingdom, and serves as Chairman of the Executive Management Committee.
Mr Kevin Khoo, is the Group Chief Operating Officer of Unisem Group, a distinguished role he has held since 1 March 2023. Mr Khoo holds a Bachelor’s Degree in Electrical Engineering from Oklahoma State University, Stillwater, Oklahoma, United States of America.
Unisem is a global provider of semiconductor assembly and test services for many of the
Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem
Unisem’s worldwide operations include factory facilities in Malaysia and China. Unisem offers a full turnkey
Unisem’s Quality Policy is to produce products and provide services of the highest quality as
General Inquiry Email: info@unisemgroup.com Human Resources Email: recruiting@unisemgroup.com Malaysia Entities
For investor-related matters please contact: Ms Sum Mee Jiun, Senior Manager, Group Affairs and Finance.
Disclosures under Sections 30(1) and 30(2) of Malaysia Companies Act 2016 Unisem (M) Berhad [Registration
Unisem is a global provider of semiconductor assembly and test services; offering an integrated suite of services such as wafer bumping, wafer probing, wafer grinding, IC packaging, and high-end RF and mixed-signal test services.
