
Ventiva develops ionic cooling technology that uses electrohydrodynamic airflow to move air without mechanical parts, acoustic noise, or vibrations.
Ventiva builds fully integrated thermal management platforms based on electrohydrodynamic flow, including an ionic cooling module, fin stack, and vapor chamber or heat pipe, for thin & light AI-ready laptops, industrial vision systems, and high-density server racks, and its modular solutions free board space that traditional cooling methods constrain. Its electrohydrodynamic airflow moves ionized air molecules within an electric field.
Ventiva's modular solutions free critical board space and enable chip-adjacent memory by removing the physical constraints that traditional cooling methods impose. Conventional cooling consumes the board space AI needs, locks in layout decisions early, and forces thermal tradeoffs that cascade through every other design choice.

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Companies similar to Ventiva include Vigilent, CoolChip Technologies, JETCOOL Technologies and Air2O.
Ventiva was founded in 2008.
Ventiva's headquarters is located in Fremont, CA, US.
Ventiva's most recent funding round was for $1.5M (USD) in March 2020.
As of Mar 11, 2020, Ventiva has disclosed funding of $17.2M (USD).
Ventiva has 11 employees as of Feb 5, 2024.