YMC Semiconductor

Fabs shrinking logic, memory, and power devices toward atomic dimensions need deposition tools that lay down thin films with tight uniformity and low particle contamination. YMC Semiconductor supplies thermal and plasma-enhanced atomic-layer deposition, epitaxy, and PECVD systems to those manufacturers, pairing multi-chamber architectures with automated wafer transfer and process software to raise throughput and stability.

The systems are developed in-house rather than resold, and span thermal ALD, PEALD, silicon and silicon-carbide epitaxy, and PECVD within a single equipment family. Covering several deposition categories instead of one tool line is what distinguishes the offering, and positions it for integrated-circuit, power-device, radio-frequency, and advanced-packaging production.