Chipbond Technology

Chipbond

Chipbond Technology Corporation reports third-quarter sales of **TWD 7,580.91 million**, up from **TWD 5,543.07 million** in the same period last year. The company provides semiconductor packaging and testing services, and the results reflect continued growth in its core operations. No further financial or operational details are disclosed in the brief announcement.

Oct 2026MarketScreenerNews article

Chipbond secures over 10 clients and 30 silicon photonics projects in one year, expanding its role in high-speed optical communications driven by AI demand. The company begins mass production of gold bump interconnects, leveraging gold’s superior conductivity for cleaner signals. Q2 monthly revenue growth exceeds 24%, marking a shift from its traditional focus on panel driver IC packaging and testing.

Jun 2026BigGo FinanceNews article

Chipbond Technology Corporation reports **TWD 21.45 billion in sales** and **TWD 2.78 billion in net income** for 2025. Sales grew 5.5% year-over-year from TWD 20.34 billion, while net income declined to TWD 2.78 billion from TWD 4.13 billion in 2024. The company operates in semiconductor packaging and advanced materials.

Feb 2026MarketScreenerNews article

Chipbond Technology opens a new semiconductor manufacturing facility in Penang, Malaysia. The move expands Malaysia’s advanced semiconductor ecosystem, supporting local production and industry growth. The facility aims to enhance regional supply chains and technological capabilities in the sector.

Feb 2026Malaysian Investment Development Authority (MIDA)News article