Chipbond Technology

Chipbond built a full-service outsourced packaging and testing business around display driver ICs, entering the semiconductor industry as a downstream provider whose driver IC work spans manufacturing, packaging and testing, and it is expanding from display driver IC packaging and testing into non-driver IC services. Its services include wafer-level bumping, wafer probing and testing, chip-on-film, chip-on-glass and wafer-level chip scale packaging, extended to compound semiconductors such as LiTaO3, GaAs, GaN and SiC.

Its full-service contract manufacturing serves customers in display technology, wireless communication, power management, automotive electronics and biomedicine. It is developing third-generation compound semiconductor process services and advanced packaging technologies with supply chain partners.