HyperLight offers TFLN Chiplet Platform
Product
TFLN Chiplet Platform is HyperLight's thin-film lithium niobate photonic integrated circuit platform for high-bandwidth optical interconnect.
- Currently Offered
TFLN Chiplet Platform is HyperLight's thin-film lithium niobate photonic integrated circuit platform for high-bandwidth optical interconnect.
HyperLight's TFLN Chiplet Platform is a thin-film lithium niobate photonic integrated circuit platform designed for high-volume manufacturing. It combines TFLN's low-loss, high-bandwidth electro-optic properties with CMOS-like fabrication to deliver optical interconnect solutions for AI data centers, telecom networks, and emerging photonics applications.
The platform supports IMDD, coherent, and co-packaged optics use cases, offering known-good dies, custom development, and multi-project wafer runs. It is manufactured through partnerships with foundries such as UMC and Wavetek and targets energy-efficient scaling of optical I/O.
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