Molex SlimStack is a microminiature board-to-board and board-to-FPC connector line with fine pitches and stack heights up to 16 millimeters.
Molex SlimStack microminiature board-to-board and board-to-FPC connectors span 0.30 to 1.25 mm pitch, 0.60 to 16.00 mm mated heights, 6 to 240 circuits, and up to 18.0 A per contact. Series include the 0.35 mm ACB6+ with a 5.0 A power nail, DuraStack with insert-molded armor nails, VersaPower high-current modules, the 0.635 mm floating series, and FSB3/FSB5 floating connectors.
SlimStack connectors resist blind-mating damage with nail structures and cover nails preventing housing damage up to 50 N, operate to 125 degrees C, and reach 40 Gbps. Floating mechanisms absorb alignment tolerance across automotive, industrial, medical, and consumer designs.
| Attribute | Molex SlimStack Board-to-Board Connectors | Flexible Stacking | |
|---|---|---|---|
| Provider | |  | |
| Founded | 1938 | 1976 | |
| Sells To | Enterprise, Government | Enterprise | |
| Pricing Model | — | Transactional | |
| Ownership | Private | — |
Founded 1938
Sells To Enterprise, Government
Pricing Model —
Ownership Private
Provider
Founded 1976
Sells To Enterprise
Pricing Model Transactional
Ownership —
I-PexI-PEX NOVASTACK 35-HDP 12 is a 0.35 mm pitch shielded board-to-board stack connector with a 3.5 mm compatible height envelope.
Amphenol RF SMPM connectors are miniature subminiature push-on RF coaxial interconnects operating through broad microwave frequencies.
I-PEX NOVASTACK 35-HDP 12 is a 0.35 mm pitch shielded board-to-board stack connector with a 3.5 mm compatible height envelope.
I-PexAmphenol's BergStak 0.80mm pitch connector is a mezzanine stacker for parallel board-to-board connections in dense designs.
Metz ConnectMETZ CONNECT female connectors are multipole board-to-board socket strips including female stacking headers for PCB and wire-to-board designs.
TE Connectivity's AD&M press-fit stacking connector joins stacked boards through solderless press-fit termination.
Samtec's High-Speed Board-to-Board line delivers high-density arrays, mezzanine strips, backplane connectors, and Edge Rate edge card systems.
TE Connectivity's Sliver internal cabled interconnects carry high-speed signals off the board to extend reach.
Amphenol's BergStak 0.80mm pitch connector is a mezzanine stacker for parallel board-to-board connections in dense designs.
METZ CONNECT female connectors are multipole board-to-board socket strips including female stacking headers for PCB and wire-to-board designs.
Metz ConnectTE Connectivity's AD&M press-fit stacking connector joins stacked boards through solderless press-fit termination.
Samtec's High-Speed Board-to-Board line delivers high-density arrays, mezzanine strips, backplane connectors, and Edge Rate edge card systems.
TE Connectivity's Sliver internal cabled interconnects carry high-speed signals off the board to extend reach.
Amphenol RF SMPM connectors are miniature subminiature push-on RF coaxial interconnects operating through broad microwave frequencies.