Samtec's High-Speed Board-to-Board line delivers high-density arrays, mezzanine strips, backplane connectors, and Edge Rate edge card systems.
Samtec's High-Speed Board-to-Board line spans high-density arrays, dual-row mezzanine strips, edge cards, ultra micro interconnects, and backplane connectors for applications where signal integrity is essential. Systems carry integral ground planes and support performance up to 56 Gbps NRZ and 112 Gbps PAM4.
Buyers get signal-integrity support through Samtec's Signal Integrity Center of Excellence, online selection tools such as Solutionator and Picture Search, and engineering help with board layout and stack height. The line serves data center, networking, test and measurement, and aerospace designs that move high-speed serial links between boards.
Amphenol
Amphenol BergStak 0.80mm Pitch
amphenol.com
Molex
Gemini Mezz Connectors
molex.com
TE Connectivity
TE Connectivity AD&M Press-Fit Stacking Connector
te.com
| Attribute | High-Speed Board-to-Board | Amphenol BergStak 0.80mm Pitch | Gemini Mezz Connectors | TE Connectivity AD&M Press-Fit Stacking Connector | |
|---|---|---|---|---|---|
| Provider | | | | | |
| Founded | 1976 | 1932 | 1938 | 2007 | |
| Sells To | Enterprise | Enterprise, Government | Enterprise, Government | — | |
| Pricing Model | Transactional | Transactional | — | — | |
| Ownership | — | Public | Private | — |
Provider
Founded 1976
Sells To Enterprise
Pricing Model Transactional
Ownership —
Provider
Founded 1932
Sells To Enterprise, Government
Pricing Model Transactional
Ownership Public
Founded 1938
Sells To Enterprise, Government
Pricing Model —
Ownership Private
Provider
Founded 2007
Sells To —
Pricing Model —
Ownership —
TE Connectivity's Sliver internal cabled interconnects carry high-speed signals off the board to extend reach.
Molex's BiPass I/O carries high-speed signals over internal Twinax cable between ASICs and front-panel I/O.
TE Connectivity's Sliver internal cabled interconnects carry high-speed signals off the board to extend reach.
Molex's BiPass I/O carries high-speed signals over internal Twinax cable between ASICs and front-panel I/O.