TE's Ruggedized Optical Backplane Interconnect is a high-density blind-mate VITA 66 fiber optic interconnect in a backplane/daughtercard form.
The Ruggedized Optical Backplane Interconnect system delivers high-density, blind-mate optical connection between backplane and daughtercard for OpenVPX architectures, supporting the VITA 66.1 and VITA 66.4 definitions with modules that accommodate up to two MT ferrules. Locating posts seat each module correctly on the backplane, while mounting screws carrying pre-applied self-locking Nylok patch material hold the interconnect in place under vibration.
Optimized receptacle design preserves optical performance as fiber optic ribbon cable feeds through the backplane to removable system modules. The system serves high-bandwidth computing in harsh-environment aerospace and defense, embedded computing, avionics, vehicle electronics, radar and imaging and targeting applications.
| Attribute | TE Connectivity Ruggedized Optical Backplane Interconnect | Optics | |
|---|---|---|---|
| Provider | |  | |
| Founded | 2007 | 1976 | |
| Sells To | — | Enterprise | |
| Pricing Model | — | Transactional |
Provider
Founded 2007
Sells To —
Pricing Model —
Provider
Founded 1976
Sells To Enterprise
Pricing Model Transactional
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Radiall C-MTitan is a high density board-to-board fiber optic connector whose cartridge protects a standard MT ferrule inside the box.
Samtec's Rugged/Power line supplies ultra-rugged interconnects, power systems, rugged I/O, and wire-to-board contact systems.
Samtec's High-Speed Board-to-Board line delivers high-density arrays, mezzanine strips, backplane connectors, and Edge Rate edge card systems.
Amphenol LEAP OBT is a rugged 12-channel full-duplex on-board optical transceiver reaching 28 Gbps per channel, 300 Gbps total throughput.
